Jinhui Wang
Education
- Postdoc. VLSI Design, University of Rochester, NY, USA
- Ph.D. Electrical Engineering, Beijing University of Technology, China
- B.S. Electrical Engineering, Hebei University, China
Research
- Artificial Intelligence (AI) technology
- Very-large-scale Integration (VLSI) Circuits and Systems
- Three-dimensional Integrated Circuit (3D IC) Design
- Neuromorphic Computing Hardware
- Emerging Memory Design
- Cooling Techniques for Electronic Devices
- Wireless Sensor Networks and IoT
- Electronic Subsystems for Unmanned Aerial Vehicles (UAV)
Publications
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J. Fu, Z. Liao, and J. Wang, “Memristor-Based Neuromorphic Hardware Improvement for Privacy-Preserving ANN,” IEEE Trans. on Very Large Scale Integration (VLSI) Systems, vol. 27, no. 12, pp. 2745-2754, December 2019.
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J. Fu, Z. Liao, N. Gong, and J. Wang, “Mitigating Nonlinear Effect of Memristive Synaptic Device for Neuromorphic Computing,” IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 9, no. 2, pp. 377-387, June 2019.
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J. Edstrom, Y. Gong, A. A. Haidous, B. Humphrey, M. E. McCourt, Y. Xu, J. Wang, and N. Gong, “Content-Adaptive Memory for Viewer-Aware Energy-Quality Scalable Mobile Video Systems,” IEEE Access, vol. 7, pp. 47479-47493, April 2019.
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J. Edstrom, D. Chen, Y. Gong, J. Wang, and N. Gong, “Data-Pattern Enabled Self-Recovery Low-Power Storage System for Big Video Data,” IEEE Trans. on Big Data, vol. 5, no. 1, pp. 95-105, January-March 2019.
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D. Chen, J. Edstrom, Y. Gong, P. Gao, L. Yang, M. McCourt, J. Wang, and N. Gong, “Viewer-Aware Intelligent Efficient Mobile Video Embedded Memory,” IEEE Trans. on Very Large Scale Integration (VLSI) Systems, vol. 26, no. 4, pp. 684-696, April 2018.
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X. Chen, S. A. Pourbakhsh, J. Fu, N. Gong, and J. Wang, “A Novel Hybrid Delay Unit Based on Dummy TSVs for 3-D On-Chip Memory,” IEEE Trans. on Very Large Scale Integration (VLSI) Systems, vol. 26, no. 7, pp. 1277-1289, July 2018.
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J. Edstrom, Y. Gong, D. Chen, J. Wang, and N. Gong, “Data-Driven Intelligent Efficient Synaptic Storage for Deep Learning,” IEEE Trans. on Circuits and Systems II, vol. 64, no. 12, pp. 1412-1416, December 2017.
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N. Gong, S. A. Pourbakhsh, X. Chen, X. Wang, D. Chen, and J. Wang, “SPIDER: Sizing-Priority Based Application-Driven Memory for Mobile Video Applications,” IEEE Trans. on Very Large Scale Integration (VLSI) Systems, vol. 25, no. 9, pp. 2625-2634, September 2017.
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J. Wang, L. Wang, H. Yin, Z. Wei, Z. Yang, and N. Gong, “cNV SRAM: CMOS Technology Compatible Non-volatile SRAM Based Ultra-Low Leakage Energy Hybrid Memory System,” IEEE Trans. on Computers, vol. 65, no. 4, pp. 1055-1067, April 2016.
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X. Peng, W. Sansen, L. Hou, J. Wang, and W. Wu, “Impedance Adapting Compensation for Low-Power Multistage Amplifiers,” IEEE Journal of Solid-State Circuits, vol. 46, no. 2, pp. 445-451, February 2011.